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26.04.2019

Armstrong Unveils Six New Models of Intelligent Design Envelope Pumps

Armstrong Unveils Six New Models of Intelligent Design Envelope Pumps (Image: Armstrong Fluid Technology)

Armstrong Fluid Technology has announced the availability of six new Design Envelope pump models engineered specifically for low-flow, high-head applications. With the current emphasis on energy and cost savings in buildings of all types, there is a growing requirement for pumps that serve lower flow ranges.

To meet this customer demand, Armstrong has added 3 new Design Envelope Tango models
25-80 (1 x 1 x 3)
32-125 (1.25 x 1.25 x 5)
40-125 (1.5 x 1.5 x 5)

and 3 new Design Envelope Vertical In-Line models
25-80 (1 x 1 x 3)
32-125 (1.25 x 1.25 x 5)
40-125 (1.5 x 1.5 x 5)

Design Envelope industry-leading pumps feature on-board intelligence, connectivity and reporting capabilities. HVAC professionals will also appreciate

  • Flow metering accuracy of +/-5 percent that optimizes the performance of the entire HVAC system
  • 29 percent more energy savings than standard variable speed pumps
  • Embedded Parallel Sensorless Pump Control for an additional 30% energy savings achieved through best-efficiency staging
  • Capability for parallel operation and redundancy allows system designers to select smaller pumps for even lower first costs
  • Easy switch from BAS to Sensorless control mode
  • Availability of an outdoor-rated version - optional

Commenting on the new Design Envelope pumps, Joachim Schulz, Commercial Director, Global Building Business said, “Design Envelope pumps offer impressive value for customers, and these six new sizes will provide a great solution for low-flow applications. Design Envelope pumps are known for providing the lowest installed cost as well as the lowest lifecycle and operating costs.”

Picture: Armstrong Unveils Six New Models of Intelligent Design Envelope Pumps (Image: Armstrong Fluid Technology)

Source: Armstrong Fluid Technology

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